| Features |
| 1. Leadless device for minimum footprint. |
| 2. Lead pad coplanarity Max. 0.002 inch/0.05mm |
| 3. Low EMI radiation |
| 4. Low Thermal Expansion permits mounting on most substrate materials. |
| 5. Built to meet MIL-T-27 specifications. |
| 6. Operating temperature range: -55℃ to +125℃ |
| 7. Temperature rise at rated DC current is less than 35℃. |
| 8. Inductance drop 30% maximum at rated current. |
| 9. Terminals meet Solderability per MIL-STD-202, Test Method 208. |
| 10. Space application: available to MIL-STD-981. |
| 11. Outgassing: TML<1%. |